Chip designer Broadcom expects to sell 1 million 3D stacked chips by 2027
Chip designer Broadcom million-inflow-ditya-irla-apital-inance-in-focus'>expects to sell 1 million 3D stacked chips by 2027 is drawing significant interest across the industry.
The company has refined the technology over five ?years to the point where its first customer, Fujitsu, is making engineering samples to test the design. Fujitsu plans to produce the stacked, or 3D, chips later this year.
Experts suggest this could influence future trends and innovation in the sector.
More updates are expected as the story develops.
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